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Considerably long carrier lifetimes in high-quality 3C-SiC(111)

机译:高质量3C-SiC(111)的载流子寿命相当长

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摘要

As a challenge and consequence due to its metastable nature, cubic silicon carbide (3C-SiC) has only shown inferior material quality compared with the established hexagonal polytypes. We report on growth of 3C-SiC(111) having a state of the art semiconductor quality in the SiC polytype family. The x-ray diffraction and low temperature photoluminescence measurements show that the cubic structure can indeed reach a very high crystal quality. As an ultimate device property, this material demonstrates a measured carrier lifetime of 8.2 mu s which is comparable with the best carrier lifetime in 4 H-SiC layers. In a 760-mu m thick layer, we show that the interface recombination can be neglected since almost all excess carriers recombines before reaching the interface while the surface recombination significantly reduces the carrier lifetime. In fact, a comparison of experimental lifetimes with numerical simulations indicates that the real bulk lifetime in such high quality 3C-SiC is in the range of 10-15 mu s.
机译:由于其亚稳性,作为挑战和结果,立方碳化硅(3C-SiC)与已建立的六边形多型体相比仅显示出较差的材料质量。我们报告了3C-SiC(111)的增长,该增长具有SiC多型家族中最先进的半导体质量。 X射线衍射和低温光致发光测量表明,立方结构确实可以达到非常高的晶体质量。作为最终的器件性能,该材料显示出测得的8.2μs的载流子寿命,与4个H-SiC层中的最佳载流子寿命相当。在760微米厚的层中,我们表明界面重组可以忽略不计,因为几乎所有多余的载流子在到达界面之前都会重新结合,而表面重组会大大缩短载流子的寿命。实际上,将实验寿命与数值模拟进行比较表明,这种高质量的3C-SiC的实际本体寿命在10-15 s的范围内。

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